TIF100-20-11U Electrical Insulation Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 To 5.0mm Thermal Gap Filler Pad for CPU

Product descriptions

TlF100-20-11U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

>Good thermal conductivity: 2.0 W/mK
>Naturally tacky needing no further adhesive coating
>Soft and Compressible for low stress applications
>Available in varies thickness

Application

>Cooling components to thechassis of frame
>Set Top Box
>Car Battery & Power Supply
>Charging Pile
>LED Tv/ Lighting
>Graphics Card Thermal Module

Prodducts specification

Standard Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm), Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Vietnam Ziitek Technology Company Limited is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.