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TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
Specifications
Brand Name :
Ziitek
Model Number :
TIF100-30-02US
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
Dielectric Breakdown Voltage :
>5500VAC
Density :
2.9g/cm³
Application :
Semiconductor, Medical Equipment, Mask Aligner
Keywords :
Thermal Silicone Pad
Color :
Gray
Thermal Conductivity :
3.0W/mK
Hardness :
20 Shore 00
Sample :
Free sample
Description

TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

Ziitek TIF®100-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.

Features:


> Good thermal conductive: 3.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Easy release construction
> Electrically isolating
> High durability


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TIF®100-30-02US Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 2.9g/cc ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 20 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 3.8 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X10¹² ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 3.0W/m-K ASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF series sheets type can add with fiberglass reinforced.
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Independent R&D team

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A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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4. We will reply you as soon as possible with Email or online.

TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

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TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100-30-02US
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor
TIF100-30-02US High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

Verified Supplier
1 Years
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Thermal Pad, Thermal Grease, Phase Changing Materials
Total Annual :
1000000-16000000
Employee Number :
200~500
Certification Level :
Verified Supplier
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