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TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
Specifications
Brand Name :
Ziitek
Model Number :
TIF100-30-05E
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
Thermal Conductivity :
3.0W/mK
Density :
3.0g/cm³
Keywords :
Thermal Pad
Color :
Gray
Hardness :
45 Shore 00
Dielectric Breakdown Voltage :
>5500VAC
Application :
High speed mass storage drives
Description

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

The TIF™100-30-05E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features:


> Good thermal conductive: 3.0W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:


> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TIF100-30-05E Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 3.0g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 35 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X10¹² ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 3.0W/m-K ASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Send your message to this supplier
Send Now

TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100-30-05E
Certification :
UL and RoHs
Place of Origin :
Vietnam
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram
TIF100-30-05E High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

Verified Supplier
1 Years
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Thermal Pad, Thermal Grease, Phase Changing Materials
Total Annual :
1000000-16000000
Employee Number :
200~500
Certification Level :
Verified Supplier
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