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Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM
Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM
Specifications
Model Number :
XSWPCB
Material :
Polyimide
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Place of Origin :
China
Copper Thickness :
4/2/2/2/2/2/2/2/2/2/2/2/2/4 oz
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
1.5 mm (Customizable)
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
14-Layer
Description

Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM

Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM is a high-performance PCB manufacturing solution designed for applications requiring exceptional thermal resistance, high current capacity, mechanical durability, and long-term reliability. Utilizing premium Polyimide (PI) substrate materials combined with thick copper technology, this multilayer PCB is ideal for power electronics, industrial automation, aerospace systems, electric vehicles, renewable energy equipment, and other mission-critical applications.

Key Specifications
Layer Count 14-Layer
Material Polyimide
Board Thickness 1.5 mm (Customizable)
Copper Thickness 4/2/2/2/2/2/2/2/2/2/2/2/2/4 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.25 mm
Minimum Line Spacing 0.25 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

Premium Polyimide Substrate Material

  • Excellent thermal resistance and dimensional stability.
  • Superior performance in high-temperature environments.
  • Ideal for aerospace, automotive, and industrial applications.

Thick Copper Technology

  • Enhanced current-carrying capability.
  • Reduced conductor resistance and voltage drop.
  • Suitable for high-power electronic systems.

Multilayer PCB Construction

  • Supports complex circuit architectures.
  • Improved signal routing and power distribution.
  • High-density design capability.

Outstanding Thermal Management

  • Efficient heat dissipation for power-intensive applications.
  • Improved reliability under continuous operation.
  • Reduced thermal stress on components.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM

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Product Detail
Model Number :
XSWPCB
Material :
Polyimide
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Contact Supplier
Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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