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Tg175℃ FR-4 Multilayer Printed Circuit Board 8 Layer PCB With Immersion Gold
Tg175℃ FR-4 Multilayer Printed Circuit Board 8 Layer PCB With Immersion Gold
Specifications
Model Number :
XSWPCB
Material :
FR-4
MOQ :
1
Delivery Time :
8-15DAYS
Minimum Hole Size :
0.2mm
Payment Terms :
Western Union
Solder Mask Color :
Green
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
1.6 Mm
Place of Origin :
China
Copper Thickness :
1/1/1/1/1/1/1/1 oz
Price :
Negotiable
Minimum Line Width :
0.1mm
Brand Name :
XSW PCB
Layer Count :
8 Layers
Description

Multilayer Printed Circuit Board 8-Layer PCBs Built On Tg175℃ FR-4 With Immersion Gold

Key Specifications
Layer Count 8 Layers
Material FR-4
Board Thickness 1.6 Mm
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.2mm
Minimum Line Width 0.1mm
Minimum Line Spacing 0.1mm
Solder Mask Color Green
Surface Finish Lead-Free HASL (Tin Spray)
Application Field

Industrial Control and Automation Systems

Our 8-layer multilayer printed circuit boards are manufactured using high TG175℃ FR-4 substrate with Immersion Gold (ENIG) surface finish. The TG175℃ high glass transition temperature laminate delivers outstanding thermal resistance and low thermal expansion coefficient, effectively preventing delamination, layer separation and via barrel cracking during multiple lead-free reflow cycles.
The 8-layer stack-up design realizes reasonable separation of power layers, ground layers and signal layers, which helps reduce crosstalk, enhance EMI shielding and support high-density, high-speed circuit layout. Immersion gold treatment provides flat, oxidation-resistant pads with stable solderability, ideal for soldering BGA, QFN and fine-pitch semiconductor components.
Customized layer stack-up, controlled impedance, blind/buried vias, board thickness and outline are available according to customer Gerber data. All production complies with IPC-A-600 standards, UL and RoHS requirements. These PCBs are widely adopted in industrial automation equipment, communication equipment, test instruments, automotive electronics and medical control modules. Prototype samples and mass-volume production orders are both acceptable.

Key Manufacturing Features

1.8-layer multilayer PCB constructed with TG175℃ high-Tg FR-4 base material
2.High thermal stability, withstand repeated lead-free SMT reflow soldering processes
3.Low Z-axis CTE, greatly lower risks of hole crack and board delamination
4.Immersion Gold (ENIG) surface finish for excellent oxidation resistance and consistent solderability
5.Rational 8-layer stack-up layout, convenient for signal, power and ground layer partition
6.Good electromagnetic shielding performance to suppress signal interference and noise
7.Support controlled impedance, blind & buried vias, HDI high-density wiring design
8.Less board warpage, highly compatible with automatic high-speed SMT assembly
9.Multiple solder mask color options: green, black, white, blue, red upon request
10.Fully RoHS compliant, UL certification can be supplied on demand

Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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Tg175℃ FR-4 Multilayer Printed Circuit Board 8 Layer PCB With Immersion Gold

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Product Detail
Model Number :
XSWPCB
Material :
FR-4
MOQ :
1
Delivery Time :
8-15DAYS
Minimum Hole Size :
0.2mm
Payment Terms :
Western Union
Contact Supplier
Tg175℃ FR-4 Multilayer Printed Circuit Board 8 Layer PCB With Immersion Gold

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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