Electric Printed Circuit Board 1.6mm Fr4 1oz 2oz 4oz Copper 8 Layer PCB Assembly
Key Specifications
| Layer Count |
8 Layers |
| Material |
FR4 |
| Board Thickness |
1.6mm |
| Copper Thickness |
1/1/1/1/1/1 oz |
| Minimum Hole Size |
0.2mm |
| Minimum Line Width |
0.1mm |
| Minimum Line Spacing |
0.1mm |
| Solder Mask Color |
Blue |
| Surface Finish |
Lead-Free HASL (Tin Spray) |
| Application Field |
Industrial Control and Automation Systems
|
This 8-layer through-hole PCB is manufactured with a lead-free HASL (Hot Air Solder Leveling) surface finish and blue solder mask, engineered for high-reliability applications requiring precise impedance control and structural integrity. The 8-layer symmetric stackup design ensures exceptional flatness with warpage controlled to ≤0.5%, making it ideal for communication equipment, industrial control systems, automotive electronics, and precision instrumentation.
Key Manufacturing Features
- 8-Layer Symmetric Stackup: Precisely engineered symmetrical lamination structure ensures balanced stress distribution and superior dimensional stability, achieving warpage ≤0.5% across the entire board.
- Lead-Free HASL Surface Finish: Environmentally compliant tin-lead-free hot air solder leveling with controlled tin spray thickness uniformity. Flux spray uniformity testing is performed before HASL processing. Vertical HASL air knife pressure is maintained at 0.3-0.5MPa, achieving a uniform tin thickness of 2-5μm with minimum 2μm at pin areas.
- Pulse-Plated Through Holes: After PTH (Plated Through Hole) copper deposition, pulse current is applied during panel plating to ensure void-free, uniform copper deposition. Hole wall copper thickness is guaranteed ≥20μm for superior electrical and thermal conductivity.
- High-Precision Etching: Outer layer etching factor is maintained at ≥3.5, ensuring sharp, well-defined trace geometries with minimal undercut for consistent impedance control across all 8 layers.
- Controlled Depth Drilling: Drill bit life is limited to 2400 holes per bit with automated depth control, preventing drill wander and ensuring clean, burr-free hole walls for reliable plating adhesion.
- Blue Solder Mask with High-Pressure Rinse: After blue oil development, high-pressure water rinsing thoroughly removes chemical residues from holes. Post-curing adhesion is verified by cross-cut (cross-hatch) testing achieving 5B rating per ASTM D3359.
Technical Specifications
| Item |
Mass Production Capability |
Extreme Capability |
| Board Thickness Range |
0.3~6.0mm |
0.3~6.0mm |
| Exposure Alignment Accuracy |
±0.015mm |
±0.005mm |
| Minimum Annular Ring |
Single side ≥0.05mm |
Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) |
0.05mm / 0.05mm |
0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) |
0.05mm / 0.05mm |
0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) |
0.075mm / 0.075mm |
0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) |
±0.005mm |
±0.005mm |
| Etching Tolerance (1/2oz base copper) |
±0.005mm |
±0.005mm |
| Etching Tolerance (1oz base copper) |
±0.0075mm |
±0.0075mm |
| Gold Finger Total Pitch Tolerance |
<30mm: ±0.05mm
30~60mm: ±0.075mm |
<30mm: ±0.03mm
30~60mm: ±0.05mm |