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4 Layer Immersion Gold AI PCB Board With 3 Side Castellated Holes
4 Layer Immersion Gold AI PCB Board With 3 Side Castellated Holes
Specifications
Material :
FR4
Minimum Hole Size :
0.2 mm three sides
Brand Name :
XSW PCB
Payment Terms :
Western Union
Minimum Line Spacing :
0.1 mm
Supply Ability :
1 Million Square feet/per month
Board Thickness :
1.2mm
Copper Thickness :
1/1/1/1 oz
Price :
Negotiable
Delivery Time :
8-15DAYS
Certification :
UL ,IOS9000
MOQ :
1
Minimum Line Width :
0.1 mm
Layer Count :
4L
Model Number :
XSWPCB
Place of Origin :
China
Description
4-layer immersion gold AI PCB board with 3-side castellated holes

Key Specifications
Layer Count 4
Material FR4
Board Thickness 1.2mm
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.2 mm three sides
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG
Application Field Module Board

Product Description:

1. Processing Flow

The standard manufacturing process for castellated hole boards is as follows:

Drilling → Electroless Copper Deposition → Circuit Patterning → Panel Plating → First Routing (Mill out castellated hole areas) → Etching → Solder Mask → Legend Printing → Electrical Testing → Second Routing (Final Outline)

2. Key Technical Points

Item Requirements
Hole Alignment The drilling center must be aligned with the castellated hole center on the same horizontal plane. The hole diameter should be drilled to intersect with the outline or be slightly smaller than the outline by ≤0.05mm.
Residual Copper Control The process of "first drill castellated holes → route edge → then etch" effectively removes residual copper, ensuring a smooth, burr-free castellated hole wall.
Plating Uniformity The "panel plating + pattern plating" process must be adopted. Pure electroless copper deposition is prohibited to ensure the hole wall plating is free from pinholes and missing plating.

3. Solder Mask Special Treatment

Parameter Specification Description
Solder Mask Clearance ≥0.1mm (0.15mm recommended) Solder mask ink is strictly prohibited from covering the metal wall of castellated holes
Solder Mask Thickness 20-25μm Slightly lower than conventional areas to avoid gaps during assembly
Opening Design Solder mask opening 0.1-0.2mm larger than hole diameter Ensures the hole wall is completely exposed

Alternatively, a more concise version:

1. Processing Flow: Drilling → Electroless Copper → Circuit → Panel Plating → 1st Routing (castellated areas) → Etching → Solder Mask → Legend → Testing → 2nd Routing (final outline)

2. Key Technical Points:

  • Hole Alignment: Drill center must align with castellated hole center; hole diameter should intersect outline or be ≤0.05mm smaller

  • Residual Copper Control: "Drill → route → etch" sequence removes residual copper, ensuring smooth burr-free hole walls

  • Plating Uniformity: Panel plating + pattern plating required; pure electroless copper prohibited to prevent pinholes and missing plating

3. Solder Mask Special Treatment:

  • Clearance: ≥0.1mm (0.15mm recommended) – no ink on castellated metal walls

  • Thickness: 20-25μm – slightly lower to avoid assembly gaps

  • Opening: 0.1-0.2mm larger than hole diameter – ensures full exposure of hole wall

Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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4 Layer Immersion Gold AI PCB Board With 3 Side Castellated Holes

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Product Detail
Material :
FR4
Minimum Hole Size :
0.2 mm three sides
Brand Name :
XSW PCB
Payment Terms :
Western Union
Minimum Line Spacing :
0.1 mm
Supply Ability :
1 Million Square feet/per month
Contact Supplier
4 Layer Immersion Gold AI PCB Board With 3 Side Castellated Holes

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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