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6 Layer Embedded Control Multilayer PCB Board With Immersion Gold
6 Layer Embedded Control Multilayer PCB Board With Immersion Gold
Specifications
Model Number :
XSWPCB
Certification :
UL ,IOS9000
Material :
FR4 TG150
Place of Origin :
China
Delivery Time :
8-15DAYS
Minimum Hole Size :
0.2 mm three sides
Minimum Line Spacing :
0.12 mm
MOQ :
1
Payment Terms :
Western Union
Board Thickness :
1.6mm
Copper Thickness :
1/1/1/1/1/1 oz
Minimum Line Width :
0.12 mm
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
6
Supply Ability :
1 Million Square feet/per month
Description
6-layer immersion gold embedded control PCB board

Key Specifications
Layer Count 6
Material FR4 TG150
Board Thickness 1.6mm
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.2 mm three sides
Minimum Line Width 0.12 mm
Minimum Line Spacing 0.12 mm
Solder Mask Color Green
Surface Finish ENIG
Application Field Embedded Control Product

Product Description:

Lamination & Material Selection

Focus Area Specific Requirements
Substrate High-Tg FR-4 (Tg ≥ 150°C, 170°C recommended), low moisture absorption, good heat resistance
Copper Foil Thickness Signal layer: 0.5oz ~ 1oz; Power/GND layer: 1oz ~ 2oz; High-current paths: ≥ 2oz
Lamination Symmetry Multilayer stack-up must be symmetrical to prevent board warpage

Design for Manufacturing (DFM)

Focus Area Recommended Design Value Typical Minimum Capability
Trace Width/Spacing ≥ 6mil 4mil
Via Hole Diameter 0.3mm (signal), 0.4~0.5mm (power) 0.2mm (laser), 0.3mm (mechanical)
Pad Size 0.1~0.2mm wider than pin —
Silkscreen Line width ≥ 5mil, keep clear of pads and vias —
Test Points Reserve on critical signals and power nets; spacing ≥ 1.27mm
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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6 Layer Embedded Control Multilayer PCB Board With Immersion Gold

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Product Detail
Model Number :
XSWPCB
Certification :
UL ,IOS9000
Material :
FR4 TG150
Place of Origin :
China
Delivery Time :
8-15DAYS
Minimum Hole Size :
0.2 mm three sides
Contact Supplier
6 Layer Embedded Control Multilayer PCB Board With Immersion Gold

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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