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Customizable 5G Optical Module PCB FR4 TG170 8 Layer PCB Manufacturer
Customizable 5G Optical Module PCB FR4 TG170 8 Layer PCB Manufacturer
Specifications
Model Number :
XSWPCB
Material :
FR4 TG170
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
0.8 mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
8-Layer
Description

Customizable 5G Optical Module PCB 8-Layer FR4-Tg 170

The Customizable 5G Optical Module PCB 8-Layer FR4-Tg 170 is designed for high-speed optical communication systems, 5G network infrastructure, data centers, and optical transceiver applications. Manufactured with high-performance FR4-Tg 170 material, this multilayer PCB offers excellent thermal stability, dimensional consistency, and electrical reliability under demanding operating conditions.

The 8-layer stack-up structure provides optimized signal routing, controlled impedance, and enhanced electromagnetic compatibility, making it ideal for high-frequency and high-bandwidth applications. Engineered to support advanced optical modules and communication equipment, the PCB ensures low signal loss, stable data transmission, and long-term reliability.

Key Specifications
Layer Count 8-Layer
Material FR-4 TG170
Board Thickness 0.8 mm (Customizable)
Copper Thickness 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

  • Optimized for 5G Optical Modules
    • Designed for high-speed optical transceivers and optical communication equipment.
    • Supports data rates required for next-generation 5G and data center applications.
  • Advanced 8-Layer PCB Structure
    • Provides dedicated signal, power, and ground layers for enhanced performance.
    • Improves signal routing efficiency and power integrity.
  • Excellent Signal Integrity
    • Controlled impedance routing minimizes signal loss and reflection.
    • Supports high-speed differential pair transmission and low-latency communication.
  • Low-Loss Material Compatibility
    • Available with high-frequency and low-Dk materials for superior electrical performance.
    • Reduces insertion loss in high-speed optical networking applications.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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Customizable 5G Optical Module PCB FR4 TG170 8 Layer PCB Manufacturer

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Product Detail
Model Number :
XSWPCB
Material :
FR4 TG170
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Contact Supplier
Customizable 5G Optical Module PCB FR4 TG170 8 Layer PCB Manufacturer

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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