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8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB Manufacturer
8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB Manufacturer
Specifications
Model Number :
XSWPCB
Material :
FR4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Place of Origin :
China
Copper Thickness :
1/1/1/1/1/1/1/1 oz
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
1.0 mm (Customizable)
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
8-Layer
Description

5G Optical Module PCB Optical Transceiver PCB High-Frequency PCB Manufacturer

This 5G optical module features an 8-layer through-hole immersion gold plating with green solder mask, controlling glass cloth protrusion on the hole walls and preventing solder bridges from the green solder mask. Drilling employs a double-sided drilling process, ensuring no glass cloth protrusion on the hole walls, a roughness ≤10μm, and a backlight rating ≥9. The width of the green solder mask is ≥75μm, measured using 3D measurement after development, and then cured at 150℃ for 70min. Plasma cleaning is performed before immersion gold plating, resulting in a gold thickness of 0.05-0.10μm, no black pads in the nickel layer, and a salt spray test duration ≥96h. Ultrasonic scanning after thermal shock shows no delamination, and the copper elongation within the holes is ≥12%. Ion contamination is ≤0.3μg/cm², and each batch undergoes a 1000h CAF test for insulation resistance ≥10^9Ω. A dedicated 5G optical module QR code is laser-engraved on the board surface.

Key Specifications
Layer Count 8-Layer
Material FR-4 TG150
Board Thickness 1.0 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.15 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

  • High-Reliability 8-Layer PCB Structure
    • Designed for 5G optical communication modules requiring high-speed signal transmission and long-term operational stability.
    • Multilayer stack-up enhances signal integrity and power distribution performance.
  • Advanced Through-Hole Quality Control
    • Double-sided drilling process effectively eliminates glass fiber protrusion on hole walls.
    • Hole wall roughness controlled to ≤10μm, improving plating uniformity and electrical reliability.
    • Backlight inspection rating reaches ≥9, ensuring excellent drilling quality.
  • Optimized Green Solder Mask Process
    • Green solder mask bridge width controlled at ≥75μm through 3D measurement verification after development.
    • Prevents solder bridging and improves assembly yield for fine-pitch components.
    • High-temperature curing at 150℃ for 70 minutes enhances adhesion and chemical resistance.
  • Premium ENIG Surface Finish
    • Plasma cleaning before immersion gold plating improves surface cleanliness and coating adhesion.
    • Gold thickness maintained at 0.05–0.10μm for excellent solderability and contact performance.
    • No black pad defects in the nickel layer, ensuring high reliability for optical module applications.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB Manufacturer

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Product Detail
Model Number :
XSWPCB
Material :
FR4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Contact Supplier
8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB Manufacturer

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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