Specifications
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Lead-free soldering
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
2.5 mm (Customizable)
Place of Origin :
China
Copper Thickness :
2/1/1/1/1/1/1/1/1/1/1/2 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
12-Layer
Description

5G Communication Module Oem Circuit Boards PCB Assembly Processing

5G Communication Module OEM Circuit Boards PCB Assembly Processing is a high-performance PCB assembly solution specifically developed for 5G communication modules, wireless networking equipment, IoT devices, telecommunications infrastructure, and high-speed data transmission systems. Designed to meet the stringent requirements of modern 5G technology, this PCB assembly service delivers excellent signal integrity, controlled impedance, low transmission loss, and superior reliability for next-generation communication applications.

Key Specifications
Layer Count 12-Layer
Material FR4
Board Thickness 2.5 mm (Customizable)
Copper Thickness 2/1/1/1/1/1/1/1/1/1/1/2 oz
Minimum Hole Size 0.25 mm
Minimum Line Width 0.25 mm
Minimum Line Spacing 0.25 mm
Solder Mask Color Green
Surface Finish Lead-free soldering

Product Description

Designed for 5G Communication Applications

  • Optimized for high-speed wireless communication systems.
  • Supports 5G NR, LTE, Wi-Fi, and IoT communication technologies.
  • Suitable for next-generation networking equipment.

High-Speed Signal Integrity

  • Advanced PCB stack-up design for high-frequency signals.
  • Reduced signal attenuation and transmission loss.
  • Stable performance in high-bandwidth applications.

Controlled Impedance PCB Technology

  • Precise impedance control for RF and high-speed circuits.
  • Improved signal quality and transmission consistency.
  • Essential for 5G communication modules.

Advanced Multilayer PCB Construction

  • Supports complex high-density circuit designs.
  • Enhanced power distribution and signal isolation.
  • Suitable for compact communication devices.

High-Precision SMT Assembly

  • Automated placement for fine-pitch components.
  • Supports BGA, QFN, CSP, LGA, and RF packages.
  • High assembly accuracy and production efficiency.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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OEM 5G Communication Module Circuit Boards 12 Layer PCB Manufacturing Assembly

Ask Latest Price
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Lead-free soldering
Payment Terms :
Western Union
Contact Supplier
OEM 5G Communication Module Circuit Boards 12 Layer PCB Manufacturing Assembly

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
Contact Supplier
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