Specifications
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Lead-free soldering
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
3.0 mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/1/1/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
4-Layer
Description

4 Layers Multilayer Metal Core Pcb Network Server ODM

The 4 Layers Multilayer Metal Core PCB for Network Server ODM is engineered for high-performance server systems, network communication equipment, data centers, and cloud computing infrastructure. Combining a robust 4-layer circuit structure with a metal core substrate, this PCB delivers superior thermal management, excellent mechanical stability, and reliable high-speed signal transmission for demanding networking applications.

Key Specifications
Layer Count 4L
Material FR4
Board Thickness 3.0 mm (Customizable)
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.25 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish Lead-free soldering

Product Description

  • 4-Layer Multilayer PCB Structure
    • Provides dedicated signal, power, and ground layers for improved circuit performance.
    • Supports complex server and networking system designs.
  • Metal Core Thermal Management
    • Excellent heat dissipation capability compared with conventional FR4 PCBs.
    • Helps maintain stable operating temperatures for high-power components.
  • Optimized for Network Server Applications
    • Designed for servers, switches, routers, storage systems, and communication equipment.
    • Supports continuous 24/7 operation in data-intensive environments.
  • High-Speed Signal Integrity
    • Controlled impedance routing minimizes signal loss and crosstalk.
    • Suitable for high-speed networking and data transmission applications.
  • Superior Mechanical Strength
    • Metal core construction enhances rigidity and structural stability.
    • Resistant to warpage and thermal deformation.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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4 Layers Multilayer Metal Core PCB Manufacturer For Network Server

Ask Latest Price
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Lead-free soldering
Payment Terms :
Western Union
Contact Supplier
4 Layers Multilayer Metal Core PCB Manufacturer For Network Server

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier

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