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10 Layer Server PCB FR4 TG150 ENIG 2.0mm PCB Assembly Services
10 Layer Server PCB FR4 TG150 ENIG 2.0mm PCB Assembly Services
Specifications
Model Number :
XSWPCB
Material :
FR4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
2.0 mm (Customizable)
Place of Origin :
China
Copper Thickness :
2/1/1/1/1/1/1/1/1/2 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
10-Layer
Description

10 Layer FR4 TG150 ENIG 2.0mm PCBA Board for Server

10 Layer FR4 TG150 ENIG 2.0mm PCBA Board for Server is a high-reliability multilayer PCB assembly solution specifically designed for servers, data centers, storage systems, networking equipment, cloud computing infrastructure, and enterprise-class computing platforms. Built with 10-layer FR4 TG150 material, 2.0mm board thickness, and a premium ENIG (Electroless Nickel Immersion Gold) surface finish, this PCBA delivers excellent signal integrity, thermal stability, power distribution, and long-term operational reliability.

Key Specifications
Layer Count 10-Layer
Material FR4 TG150
Board Thickness 2.0 mm (Customizable)
Copper Thickness 2/1/1/1/1/1/1/1/1/2 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.2 mm
Minimum Line Spacing 0.2 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

10-Layer High-Density PCB Design

  • Advanced 10-layer stack-up for complex server architectures.
  • Dedicated signal, power, and ground planes.
  • Supports high-speed computing and networking applications.

FR4 TG150 High-Tg Material

  • Glass transition temperature (Tg) of 150°C.
  • Excellent thermal stability and dimensional control.
  • Suitable for high-power and continuous-operation environments.

2.0mm Heavy-Duty Board Thickness

  • Enhanced mechanical strength and rigidity.
  • Improved resistance to warping and deformation.
  • Ideal for large server motherboard applications.

Premium ENIG Surface Finish

  • Excellent solderability and oxidation resistance.
  • Flat surface for BGA, CPU, and memory device assembly.
  • Improved long-term reliability of solder joints.

Superior Signal Integrity

  • Optimized for high-speed server communication.
  • Reduced signal loss, EMI, and crosstalk.
  • Supports PCIe, DDR memory, Ethernet, and high-speed interfaces.

High Current Carrying Capability

  • Optimized power plane design.
  • Stable power delivery to processors and critical components.
  • Suitable for high-performance computing systems.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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10 Layer Server PCB FR4 TG150 ENIG 2.0mm PCB Assembly Services

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Product Detail
Model Number :
XSWPCB
Material :
FR4 TG150
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Contact Supplier
10 Layer Server PCB FR4 TG150 ENIG 2.0mm PCB Assembly Services

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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