Specifications
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Green
Payment Terms :
Western Union
Place of Origin :
China
Copper Thickness :
1/1/1/1/1/1/1/1/1/1/1/1 oz
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
1.6 mm (Customizable)
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
12-Layer
Description

12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

The 12 Layers Server Communication PCB is engineered for high-speed data processing, secure communication, and large-scale data storage applications. Designed with a complex multilayer stack-up, this PCB provides exceptional signal integrity, power distribution efficiency, and electromagnetic interference (EMI) suppression required by modern servers, data centers, cloud computing platforms, and communication equipment.

Manufactured using high-quality low-loss materials and advanced PCB fabrication technology, the board supports high-frequency signal transmission, high-density component integration, and reliable long-term operation. Its 12-layer architecture enables optimized routing for high-speed interfaces, ensuring stable performance in mission-critical networking, storage, and enterprise computing environments.

Key Specifications
Layer Count 12-Layer
Material FR4
Board Thickness 1.6 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.25 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

  • 12-Layer High-Density Design
    • Provides ample routing space for complex server and communication circuits.
    • Supports high-density component placement and advanced processor architectures.
  • High-Speed Signal Integrity
    • Optimized stack-up structure minimizes signal loss, crosstalk, and transmission delays.
    • Suitable for high-speed networking and data communication protocols.
  • Fast Data Processing Capability
    • Designed to support multi-core processors, memory modules, and high-bandwidth interfaces.
    • Enables efficient data transfer within server and storage systems.
  • Enhanced Data Security and Reliability
    • Stable power distribution and signal routing help ensure secure and uninterrupted system operation.
    • Reduces communication errors in critical applications.
  • Excellent EMI and EMC Performance
    • Multiple ground and power planes improve electromagnetic compatibility.
    • Minimizes interference in high-frequency environments.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

Ask Latest Price
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Green
Payment Terms :
Western Union
Contact Supplier
12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier

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