IS42S16320B-7TL SDRAM 64Mb Density 166MHz Speed 3.3V Operation 16Mx16 Organization LVTTL Interface Industrial Temp (-40°C~85°C) Compact TSOP-II Package High Reliability

FEATURES

• Clock frequency: 166, 143, 133 MHz

• Fully synchronous; all signals referenced to a positive clock edge

• Internal bank for hiding row access/precharge

• Power supply

Vdd Vddq

IS42/45S16320B 3.3V 3.3V

IS42S86400B 3.3V 3.3V

• LVTTL interface

• Programmable burst length – (1, 2, 4, 8, full page)

• Programmable burst sequence: Sequential/Interleave

• Auto Refresh (CBR)

• Self Refresh

• 8K refresh cycles every 16ms (A2 grade) or 64 ms (Commercial, Industrial, A1 grade)

• Random column address every clock cycle

• Programmable CAS latency (2, 3 clocks)

• Burst read/write and burst read/single write operations capability

• Burst termination by burst stop and precharge command

• Available in 54-pin TSOP-II and 54-ball W-BGA (x16 only)

• Operating Temperature Range:

Commercial: 0oC to +70oC

Industrial: -40oC to +85oC

Automotive, A1: -40oC to +85oC

Automotive, A2: -40oC to +105oC

OVERVIEW

ISSI's 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows.

DEVICE OVERVIEW

The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 3.3V Vdd and 3.3V Vddq memory systems containing 536,870,912 bits. Internally configured as a quad-bank DRAM with a synchronous interface. Each 134,217,728-bit bank is or ganized as 8,192 rows by 1024 columns by 16 bits. Each of the x8's 134,217,728-bit banks is organized as 8,192 rows by 2048 columns by 8 bits.

The 512Mb SDRAM includes an AUTO REFRESH MODE, and a power-saving, power-down mode. All signals are registered on the positive edge of the clock signal, CLK. All inputs and outputs are LVTTL compatible.

The 512Mb SDRAM has the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time and the capability to randomly change column addresses on each clock cycle during burst access.

A self-timed row precharge initiated at the end of the burst sequence is available with the AUTO PRECHARGE function enabled. Precharge one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed, random-access operation.

SDRAM read and write accesses are burst oriented starting at a selected location and continuing for a programmed number of locations in a programmed sequence. The registration of an ACTIVE command begins accesses, followed by a READ or WRITE command. The ACTIVE command in conjunction with address bits registered are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The READ or WRITE commands in conjunction with address bits registered are used to select the starting column location for the burst access.

Programmable READ or WRITE burst lengths consist of 1, 2, 4 and 8 locations or full page, with a burst terminate option.

DESCRIPTION

The 512Mb SDRAMs are quad-bank DRAMs which operate at 3.3V and include a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 134,217,728-bit banks is organized as 8,192 rows by 1024 columns by 16 bits or 8192 rows by 2048 columns by 8bits.

Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0 A12 select the row). The address bits A0-A9 (x16); A0-A9, A11 (x8) registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.

Prior to normal operation, the SDRAM must be initial ized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation.

INFORMATION

Drawing

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