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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
Specifications
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Payment Terms :
L/C,Western Union,T/T
Supply Ability :
100000 rolls per month
Delivery Time :
5-8 WORKING DAYS
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Application :
Semiconductor Packaging, Microelectronics, Medical Devices
Package :
Spool
Corrosion Resistance :
High
Material :
Gold
Length Meters :
500/1000
Product Type :
Bonding Wire
Coating :
Gold
Bonding Method :
Ultrasonic
Temperature Range :
-40°C to 200°C
Surface Finish :
Bright
Conductivity :
98%
Description
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30µm (1.2mil) gold wire is widely used in aerospace components requiring higher current load, stronger mechanical strength, and better vibration resistance. This article focuses on the conductivity stability of 18µm (0.7mil) gold bonding wire, its advantages, and typical applications in aerospace—for engineers, purchasers, and R&D teams seeking high‑reliability bonding solutions.
Features
  • Designed specifically for wire bonding
  • Au100 alloy
  • 1,064°C (1,947°F) melting point
  • Lead-free, RoHS 3 compliant, and REACH compliant
  • 100m (328 feet) length
  • >12 months shelf life
  • 4N (>99.99%) purity
  • 950mg wire weight
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

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Product Detail
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Contact Supplier
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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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