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1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
Specifications
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Payment Terms :
L/C,Western Union,T/T
Supply Ability :
100000 rolls per month
Delivery Time :
5-8 WORKING DAYS
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Application :
Semiconductor Packaging, Microelectronics, Medical Devices
Package :
Spool
Corrosion Resistance :
High
Material :
Gold
Length Meters :
500/1000
Product Type :
Bonding Wire
Coating :
Gold
Bonding Method :
Ultrasonic
Temperature Range :
-40°C to 200°C
Surface Finish :
Bright
Conductivity :
98%
Description
Gold Bonding Wire Au99.99% - 100m Per Spool (0.025mm Diameter)
High purity 99.99% (4N) fine gold wire for scientific research, medical, aerospace, and electrical applications. Offers excellent electrical properties and low reactivity for stability in harsh environments.
Material Gold
Diameter 0.0125, 0.05, etc. mm
Form Wire
Purity ≥99.99%
The main body is pure gold (Au > 99.999%), adding beryllium, rare earth and other trace elements, through smelting, wire drawing, heat treatment and other processes to obtain different properties, to meet the different needs of gold wire, gold bonding wire is the most stable in all bonding wire.
Medical Applications
  • Electrosurgery equipment
  • Guide wires and stents
  • Life-support devices
  • Medical markers for X-rays (provides radiopacity)
  • CV therapies
  • In vitro diagnostic devices
Aerospace Applications
  • Wire-wound potentiometers
  • Aerospace instrumentation (avionics)
  • Radio communication equipment
  • Temperature regulation sensors
Electrical Applications
  • Imaging devices and televisions
  • Smartphones and computers
  • LED technology
  • Orthodontic appliances
  • Wire bonding for integrated circuits
  • Motherboard connections and microprocessor mounting
Product Images
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
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1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging

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Product Detail
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Contact Supplier
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1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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