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Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Specifications
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Payment Terms :
L/C,Western Union,T/T
Supply Ability :
100000 rolls per month
Delivery Time :
5-8 WORKING DAYS
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Application :
Semiconductor Packaging, Microelectronics, Medical Devices
Package :
Spool
Corrosion Resistance :
High
Material :
Gold
Length Meters :
500/1000
Product Type :
Bonding Wire
Coating :
Gold
Bonding Method :
Ultrasonic
Temperature Range :
-40°C to 200°C
Surface Finish :
Bright
Conductivity :
98%
Description
Material Gold
Diameter 0.0125, 0.05, etc. mm
Form Wire
Purity ≥99.99%

Made from ultra-high purity gold (2N-4N), the Gold Bonding Wire is a key component in semiconductor assembly, providing excellent electrical conductivity for reliable connections. It is highly durable and resistant to corrosion, making it ideal for use in harsh environments. The wire is available in ultra-fine diameters ranging from 13 μm to 70 μm and in lengths from 100 meters to 500 meters. The ability to customize these specifications ensures flexibility for a wide range of applications, from advanced integrated circuits to microelectronic devices. Known for its exceptional mechanical properties and thermal conductivity, this bonding wire ensures stable, efficient, and long-lasting connections in high-performance devices.

Gold Wire Applications

  • Electronics and Semiconductors: Gold wire is extensively used in the electronics industry for bonding in semiconductor devices.
  • Electrical Contacts and Connectors: Due to its high conductivity and resistance to corrosion, gold wire is used in the manufacturing of electrical contacts and connectors.
  • Medical Devices: In medical devices, gold wire is used for its biocompatibility and conductive properties. It can be found in pacemakers, diagnostic equipment, and other implantable devices where reliable performance is crucial.
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
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Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging

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Product Detail
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Contact Supplier
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Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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