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4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
Specifications
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Payment Terms :
L/C,Western Union,T/T
Supply Ability :
100000 rolls per month
Delivery Time :
5-8 WORKING DAYS
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Application :
Semiconductor Packaging, Microelectronics, Medical Devices
Package :
Spool
Corrosion Resistance :
High
Material :
Gold
Length Meters :
500/1000
Product Type :
Bonding Wire
Coating :
Gold
Bonding Method :
Ultrasonic
Temperature Range :
-40°C to 200°C
Surface Finish :
Bright
Conductivity :
98%
Description
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
High Purity Gold > 99.99% (4N). Designed specifically for wire bonding. Gold bonding wire is used to connect electrical components in many industries, including electronics, aerospace and medicine. Gold bonding wire has excellent electrical conductivity, stability and resistance to corrosion. It is an important material in semiconductor and electronic device manufacturing. It is commonly used for wire bonding to electrically connect microchip semiconductor dies to the terminals of a chip package or directly to a substrate. Commonly used by integrated circuit (IC) packaging shops, research labs and advanced manufacturing facilities.
Features
  • Designed specifically for wire bonding
  • Au100 alloy
  • 1,064°C (1,947°F) melting point
  • Lead-free, RoHS 3 compliant, and REACH compliant
  • 100m (328 feet) length
  • >12 months shelf life
  • 4N (>99.99%) purity
  • 950mg wire weight
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
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4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs

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Product Detail
Brand Name :
WINNER
Model Number :
MW001
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Contact Supplier
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4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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