Microfocus X-Ray Inspection System X6800
Industrial SMT PCB defect detection system featuring automated batch inspection, providing high-precision imaging for BGA solder voids and PCB through-holes with 5μm focal spot technology.
Software Capabilities
Basic Operation
Full keyboard and mouse control covers all functions, including X-ray tube activation and parameter adjustment.
Measurement Tools
Comprehensive measurement functions including distance, angle, radius, perimeter, and distance rate calculations for through-hole soldering analysis.
Automated Inspection
Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.
Image Processing
Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.
Voids Rate Measurement
Automatically computes solder ball void rate area and perimeter, identifies defects, and supports manual void marking with parameter storage for stable and consistent inspection results.