WELLMAN Microfocus X-Ray Inspection System X6000
Industrial SMT PCB defect detection system featuring automated batch inspection with high precision imaging for BGA solder voids and PCB through-holes.
Software Capabilities
Basic Operation
Full keyboard and mouse control for all functions, including X-ray tube activation and parameter adjustment.
Measurement Tools
Comprehensive measurement functions support distance, angle, radius, perimeter and distance rate calculations for through-hole soldering analysis.
Automated Inspection
Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.
Image Processing
Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.
Voids Rate Measurement
Automatically calculates solder ball voids rate area and circumference and identifies defects supports manual void marking and parameter saving for consistent results.