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Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Specifications
Certification :
CE,ISO9001,FDA
Model Number :
X6800
Focal Spot Size :
5μm
MOQ :
1
Packaging Details :
Wooden case
Supply Ability :
Worldwide supply
Payment Terms :
T/T
Delivery Time :
7 work days
Brand Name :
WELLMAN
Max Tube Voltage :
90kV
Place of Origin :
China
Description
Automated Microfocus X-Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Working Principle
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Key Advantages
  • Speed adjustable 5-axis linkage system
  • New generation 5" HD digital flat panel detector
  • 530×530mm table with 10KG load capacity
  • FPD tilts up to 60° without sacrificing magnification
  • Inspection procedures for automated batch inspection
  • Closed type X-ray tube with over 10,000 hours lifetime
Hardware Parameters
X-ray Source
TypeClosed, microfocus
Max Tube Voltage90kV
Max Tube Current200μA
Focal Spot Size5μm
FunctionAuto preheat
Flat Panel Detector
Effective Area130mm×130mm
Pixel Size85μm
Resolution1536×1536
Frame Rate20fps
Tiltable Angle60°
Table
Size530mm×530mm
Detectable Area500mm×500mm
Max Load10kg
Equipment Specifications
MagnificationGeometry 200X | System 1500X
Inspection SpeedMax 3.0s/point
Dimensions1360mm (L) × 1365mm (W) × 1730mm (H)
Weight1200kg
Power SupplyAC110-220V 50/60HZ
Max Power1500W
Industrial PCI5 CPU, 8G RAM, 500GB SSD
Displayer24" HDMI LCD
Software Functionality
Core Operations
Function ModuleKeyboard and mouse complete all operations
X-ray Tube ControlMouse-click activation with real-time voltage/current display and adjustable parameters
Status BarVisual indicators for interlock status, pre-heat status, and X-ray status
Image Effect AdjustmentAdjustable brightness, contrast and gain for optimal imaging
Product ListSave and recall inspection parameters for improved efficiency
Navigation WindowClick-to-move table positioning with camera guidance
Motion Axis StatusReal-time coordinate display
Inspection ResultOrganized display of measurement results including voids rate, distance, area
Speed ControlAdjustable movement speed for each axis
Voids Rate Measurement
Automatic CalculationRectangle-based solder ball analysis with automatic void detection and NG/OK indication
Parameters AdjustmentCustomizable grayscale threshold, pixel, contrast, and size filtering parameters
Add Voids ManuallyPolygon or free-form drawing for manual void inclusion
Save ParametersStore and recall measurement parameters for consistent product inspection
Additional Measurement Functions
DistanceVertical distance measurement from point to baseline
Distance RatePercentage ratio calculation for through-hole soldering rate measurement
AngleAngle measurement between defined rays
RadiusCircle measurement for round components with circumference, area and radius calculation
PerimeterSquare component measurement with length, width and area calculation
Automatic Inspection
Manual SettingCustom inspection point positioning with automatic inspection and image saving
ArrayAutomated inspection of regular patterns using row and column configuration
Automatic IdentificationFeature-based automatic position identification with measurement and image capture
Safety Features
Radiation LeakageNo leakage
Lead Glass Observation WindowTransparent lead glass window shields radiation to observe inner status
Window and Back Door Safety InterlockAutomatic X-ray power off when opened
Electromagnetic Safety SwitchLocks observation window when X-ray is active
Emergency StopLocated near operation position for immediate power cutoff
Tube ProtectionPrevents software exit without proper X-ray tube shutdown
Application Examples
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
BGA Solder Bridge
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
BGA Solder Voids
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
PCB Through-Hole
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
IC Voids and Gold Wire
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
LED Solder Voids
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
LED Gold Wire Crack
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Capacitor
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Inductor
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Sensor
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Thyristor Surge Suppressors
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Fiberglass
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Cable
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Diode
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Steel Pipe Welding Gap
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Automotive Electronic
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Product Detail
Certification :
CE,ISO9001,FDA
Model Number :
X6800
Focal Spot Size :
5μm
MOQ :
1
Packaging Details :
Wooden case
Supply Ability :
Worldwide supply
Contact Supplier
video
Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution

SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.

Verified Supplier
2 Years
shenzhen
Since 2018
Business Type :
Manufacturer
Main Products :
X Ray Counter, PCB X Ray Machine, SMD Tower
Certification Level :
Verified Supplier
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