PCBA Temporary Fixing UV/Heat Cure Glue Description

"Fast fixing, wave soldering safe." This PCBA temporary fixing UV/heat cure glue (3769B) is a solvent-free, fast-curing adhesive designed for temporary component fixing on PCBA automated assembly lines. With high thixotropy for excellent build-up and no slump, it delivers outstanding adhesion to PCB and metals, and its high elongation allows components to pass safely through wave soldering and reflow soldering.

PCBA Temporary Fixing UV/Heat Cure Glue Datasheet

Product Details Description

Product Applications

• PCBA temporary fixing of SMT components before wave soldering
• Component fixation on automated PCBA assembly lines
• Wave soldering and reflow soldering protection
• PCB and metal component adhesion
• Temporary bonding of components during reflow oven passage
• Electronics assembly line temporary fixing
• Fixing of connectors, SMD parts and heavy components before soldering

Precautions

• Surfaces must be clean, dry and free of oil, dust or flux residues before applying.
• High thixotropy keeps the adhesive in place; dispense precisely to avoid component movement.
• UV curing requires light to reach the adhesive; shadowed or blocked areas may not fully cure and may need heat cure.
• Apply in a well-ventilated area. Avoid contact with skin and eyes; wear protective gloves and safety goggles.
• In case of skin or eye contact, rinse immediately with plenty of clean water and seek medical advice if irritation persists.
• Store sealed at 8-28°C in a cool, dark and dry place away from direct sunlight, and keep out of reach of children.
• Fixing performance may vary with substrate, gap and UV intensity; please run a test before mass production.

FAQ

Q1: How does this PCBA temporary fixing glue cure?

It cures rapidly under UV light with a recommended cumulative UV energy of 300 mJ/cm². Curing speed depends on UV intensity, wavelength and layer thickness.

Q2: What substrates can it bond?

It offers excellent adhesion to PCB substrates and metals, making it suitable for fixing components on populated boards.

Q3: Is it safe for wave soldering and reflow soldering?

Yes. With a high elongation at break (400%) and high elasticity, it holds components securely and can pass safely through wave soldering and reflow soldering.

Q4: What is the advantage of the high thixotropy?

The high thixotropy (viscosity 85,000 mPa·s) gives excellent build-up with no slump, keeping the adhesive exactly where dispensed for stable component fixing.

Q5: What is the packaging and minimum order quantity?

Standard packaging is 50g / 300g bottles, and the minimum order quantity is 10 pieces. Custom packaging is available on request.

Q6: How should it be stored and what is its shelf life?

Store sealed at 8-28°C in a cool, dark and dry place away from direct sunlight. Unopened shelf life is approximately 12 months.