Specifications
Viscosity (25°C) :
75000±15000 mPa.s
Place of Origin :
China
Tensile Strength :
2.5 MPa
Thixotropy :
High, excellent stacking and bead retention
Payment Terms :
T/T,L/C
Color :
Red / Blue
Compression Rebound :
Excellent elastic recovery
Shelf Life :
12 months (8-28°C)
Solder Resistance :
Wave soldering and reflow soldering resistant
MOQ :
10 Pieces
Elongation at Break :
300%
Application :
Phone sealing gasket, formed-in-place gasket (FIPG)
Delivery Time :
5-8 work days
Packaging :
50g / 1kg
Adhesion :
Excellent to metal and plastic
Packaging Details :
Plastic bottle, 50g/1kg per unit, export-grade carton
Curing Condition :
800 mJ/cm² (UV)
Supply Ability :
3000 Kilograms per Month
Model Number :
3508
Hardness :
Shore A 52
Certification :
RoHS, REACH, ISO10993 certified
Brand Name :
Super-curing
Price :
USD 3.99 / Piece/50g
Description

UV Curing Phone Sealing Gasket Adhesive

3508 UV Curing Phone Sealing Gasket Adhesive is a red / blue, fast-curing and solvent-free UV adhesive specially formulated for phone sealing gasket and formed-in-place gasket (FIPG) applications. It combines fast UV curing, high thixotropy with excellent stacking and bead retention, outstanding compression rebound, and excellent adhesion to metals and plastics. It is also resistant to wave soldering and reflow soldering processes, making it ideal for reliable sealing and waterproofing of mobile phones and precision electronic devices.

Key Features

  • Fast curing and solvent-free UV formulation
  • Resistant to wave soldering and reflow soldering processes
  • High thixotropy with excellent stacking and bead retention
  • Excellent compression rebound and elastic recovery
  • Excellent adhesion to metals and plastics
  • Soft Shore A 52 hardness with 300% elongation at break

Applications

  • Phone sealing gasket and formed-in-place gasket (FIPG) sealing
  • Waterproof and dustproof sealing of mobile phone housings
  • Bonding and sealing of metal and plastic components
  • Electronic device sealing requiring wave / reflow soldering resistance
  • Cushioning and compression sealing of precision components

UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound

UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound

Technical Specifications

Color Red / Blue
Viscosity (25°C) 75000±15000 mPa.s
Curing Condition 800 mJ/cm² (UV)
Hardness Shore A 52
Tensile Strength 2.5 MPa
Elongation at Break 300%
Shelf Life 12 months (8-28°C)
Packaging 50g / 1kg

FAQ

Q1: What is the 3508 adhesive mainly used for?
3508 is a UV curing phone sealing gasket adhesive for formed-in-place gasket (FIPG) sealing and waterproofing of mobile phones and precision electronic devices.


Q2: How fast does it cure and is it solvent free?
3508 cures quickly under UV light at 800 mJ/cm² and is a solvent-free formulation, delivering a fast yet odorless and environmentally friendly bonding process.


Q3: Is it resistant to soldering processes?
Yes. 3508 is resistant to both wave soldering and reflow soldering, allowing it to withstand the thermal conditions of typical electronics assembly lines.


Q4: What are the thixotropy and stacking performance?
3508 features high thixotropy with excellent stacking and bead retention, so it maintains its shape after dispensing without sagging, even on vertical or complex surfaces.


Q5: What materials does it adhere to?
3508 provides excellent adhesion to both metals and plastics, making it suitable for sealing and bonding metal and plastic components of phone housings and other electronic assemblies.


Q6: What are the storage conditions and packaging?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 50g and 1kg packaging.


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UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound

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Viscosity (25°C) :
75000±15000 mPa.s
Place of Origin :
China
Tensile Strength :
2.5 MPa
Thixotropy :
High, excellent stacking and bead retention
Payment Terms :
T/T,L/C
Color :
Red / Blue
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video
UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound
UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound
UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound

Shenzhen Super- curing Opto-Electronic CO., Ltd

Verified Supplier
5 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Total Annual :
1500000-2000000
Employee Number :
15~20
Certification Level :
Verified Supplier
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