Specifications
Brand Name :
Super-curing
Certification :
RoHS, REACH, ISO10993 certified
MOQ :
10 Pieces
Packaging Details :
Plastic bottle, 50g/1kg per unit, export-grade carton
Viscosity (25°C) :
6000±1000 mPa.s
Delivery Time :
5-8 work days
Supply Ability :
3000 Kilograms per Month
Color :
Transparent black
Glass Transition Temperature (Tg) :
10°C
Application :
BGA chip stiffening, component bottom fixation
Place of Origin :
China
Shelf Life :
12 months (8-28°C)
Payment Terms :
T/T,L/C
Dielectric Strength :
20 kV/mm
Packaging :
50g / 1kg
Model Number :
3526
Curing Condition :
600 mJ/cm2 (LED UV)
Price :
USD 3.99 / Piece/50g
Hardness :
Shore D 40
Description

Fast Curing UV Curable Adhesive

Fast Curing UV Curable Adhesive is a transparent black, LED-curable adhesive specially formulated for BGA chip stiffening and component bottom fixation. It offers high adhesion with excellent flexibility, low shrinkage and low dielectric constant, high thixotropy with good color visibility for easy dispensing, and LED 3-5 second fast curing, delivering reliable stiffening and protection for sensitive electronic components.

Key Features

  • Fast curing with LED 3-5 second cure for high-efficiency production
  • High adhesion with excellent flexibility for reliable BGA chip stiffening
  • Low shrinkage and low dielectric constant protect sensitive components
  • High thixotropy with good color visibility for easy and precise dispensing
  • Transparent black appearance for clean finished look and easy inspection
  • High dielectric strength of 20 kV/mm for insulation protection

Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Applications

  • BGA chip stiffening (four-corner fixing) on PCB assemblies
  • Component bottom fixation and underfill
  • High-speed LED curing assembly lines
  • Fixing of sensitive electronic components requiring low stress
  • Protection of chips and components in consumer electronics

Technical Specifications

Color Transparent black
Viscosity (25°C) 6000±1000 mPa.s
Curing Condition 600 mJ/cm² (LED UV)
Hardness Shore D 40
Glass Transition Temperature (Tg) 10°C
Dielectric Strength 20 kV/mm
Shelf Life 12 months (8-28°C)
Packaging 50g / 1kg

FAQ

Q1: What is the 3526 adhesive mainly used for?
3526 is an LED-curable UV adhesive used for BGA chip stiffening and component bottom fixation, providing reliable fixing and protection for sensitive electronic components.

Q2: How fast does it cure?
3526 features LED 3-5 second fast curing at 600 mJ/cm², enabling high-efficiency production lines.

Q3: Is the cured adhesive flexible?
Yes. With Shore D 40 hardness, the cured adhesive offers excellent flexibility, helping to absorb stress and protect chips and delicate components.

Q4: Why are low shrinkage and low dielectric constant important?
Low shrinkage reduces internal stress during curing, while the low dielectric constant minimizes signal interference, making 3526 ideal for sensitive electronic applications.

Q5: What does the adhesive look like?
3526 is a transparent black adhesive with good color visibility, allowing easy inspection and precise dispensing during application.

Q6: What are the storage conditions?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 50g and 1kg packaging.

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Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Ask Latest Price
Brand Name :
Super-curing
Certification :
RoHS, REACH, ISO10993 certified
MOQ :
10 Pieces
Packaging Details :
Plastic bottle, 50g/1kg per unit, export-grade carton
Viscosity (25°C) :
6000±1000 mPa.s
Delivery Time :
5-8 work days
Contact Supplier
Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation
Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation
Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation
Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation
Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Shenzhen Super- curing Opto-Electronic CO., Ltd

Verified Supplier
5 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Total Annual :
1500000-2000000
Employee Number :
15~20
Certification Level :
Verified Supplier
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