Specifications
Supply Ability :
3000 Kilograms per Month
Shelf Life :
12 months (8-28°C)
Price :
USD 3.99 / Piece/50g
Dielectric Strength :
20 kV/mm
Payment Terms :
T/T,L/C
Packaging :
250ml / 1kg
Curing Condition :
400 mJ/cm² (UV)
Viscosity (25°C) :
6000±500 mPa.s
Glass Transition Temperature (Tg) :
72°C
Application :
Solder joint protection, wire reinforcement and strain relief
Delivery Time :
5-8 work days
Color :
Amber transparent
Brand Name :
Super-curing
Certification :
RoHS, REACH, ISO10993 certified
Model Number :
3166
MOQ :
10 Pieces
Hardness :
Shore D 78
Place of Origin :
China
Packaging Details :
Plastic bottle, 250ml/1kg per unit, export-grade carton
Description

UV Curing Solder Joint Protection Adhesive

3166 UV Curing Solder Joint Protection Adhesive is a thixotropic medium-high viscosity adhesive specially formulated for the protection of electronic solder joints and the reinforcement and strengthening of wires and cables. It features excellent surface drying and deep curing performance, good extrusion property, and broad adhesion to various plastics, metals and glass. After curing, it forms a hard amber transparent protective layer with outstanding moisture-proof and insulating performance, providing long-term reliable protection for solder joints and wire terminations.

Key Features

  • Thixotropic medium-high viscosity of 6000±500 mPa.s for sag-resistant and precise dispensing
  • Excellent surface drying and deep curing performance at 400 mJ/cm²
  • Good extrusion property for smooth and efficient application
  • Broad adhesion to various plastics, metals and glass
  • High hardness of Shore D 78 and glass transition temperature of 72°C for durable protection
  • High dielectric strength of 20 kV/mm for reliable insulation protection

3166 UV Curing Solder Joint Protection Adhesive Thixotropic Medium High Viscosity Surface Deep Cure Wire Reinforcement

Applications

  • Protection and reinforcement of electronic solder joints
  • Reinforcement and strain relief of wires and cables
  • Strengthening of solder joints on PCB assemblies
  • Bonding and protection of plastic, metal and glass components
  • Moisture-proof and insulating protection of electronic assemblies

Technical Specifications

Color Amber transparent
Viscosity (25°C) 6000±500 mPa.s
Curing Condition 400 mJ/cm² (UV)
Hardness Shore D 78
Glass Transition Temperature (Tg) 72°C
Dielectric Strength 20 kV/mm
Shelf Life 12 months (8-28°C)
Packaging 250ml / 1kg

FAQ

Q1: What is the 3166 adhesive mainly used for?
3166 is a UV curing adhesive used for the protection of electronic solder joints and the reinforcement and strain relief of wires and cables, providing moisture-proof, insulating and aging-resistant protection.


Q2: How fast does it cure?
3166 offers excellent surface drying and deep curing performance at 400 mJ/cm², ensuring reliable curing of both thin surface layers and thicker adhesive deposits.


Q3: Why is the thixotropic feature important?
The thixotropic medium-high viscosity keeps the adhesive in place after dispensing without sagging or flowing, while the good extrusion property ensures smooth and precise application.


Q4: What materials does it adhere to?
3166 provides broad adhesion to various plastics, metals and glass, which are commonly used in electronic assemblies and wire terminations.


Q5: What is the cured product like?
After curing, 3166 forms a hard amber transparent protective layer with Shore D 78 hardness, 72°C glass transition temperature and 20 kV/mm dielectric strength.


Q6: What are the storage conditions?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 250ml and 1kg packaging.

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3166 UV Curing Solder Joint Protection Adhesive Thixotropic Medium High Viscosity Surface Deep Cure Wire Reinforcement

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Supply Ability :
3000 Kilograms per Month
Shelf Life :
12 months (8-28°C)
Price :
USD 3.99 / Piece/50g
Dielectric Strength :
20 kV/mm
Payment Terms :
T/T,L/C
Packaging :
250ml / 1kg
Contact Supplier
video
3166 UV Curing Solder Joint Protection Adhesive Thixotropic Medium High Viscosity Surface Deep Cure Wire Reinforcement
3166 UV Curing Solder Joint Protection Adhesive Thixotropic Medium High Viscosity Surface Deep Cure Wire Reinforcement
3166 UV Curing Solder Joint Protection Adhesive Thixotropic Medium High Viscosity Surface Deep Cure Wire Reinforcement
3166 UV Curing Solder Joint Protection Adhesive Thixotropic Medium High Viscosity Surface Deep Cure Wire Reinforcement

Shenzhen Super- curing Opto-Electronic CO., Ltd

Verified Supplier
5 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Total Annual :
1500000-2000000
Employee Number :
15~20
Certification Level :
Verified Supplier
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