Specifications
Viscosity (25°C) :
25000±10000 mPa.s
Model Number :
3290
Payment Terms :
T/T,L/C
Dielectric Strength :
23 kV/mm
Certification :
RoHS, REACH, ISO10993 certified
Price :
USD 3.99 / Piece/50g
Color :
Transparent blue
Place of Origin :
China
Packaging :
50g / 300g
Shelf Life :
12 months (8-28°C)
Application :
Chip fixing, component reinforcement, shadow area curing
Brand Name :
Super-curing
Supply Ability :
3000 Kilograms per Month
Curing Condition :
800 mJ/cm² (UV + moisture)
MOQ :
10 Pieces
Packaging Details :
Syringe/plastic bottle, 50g/300g per unit, export-grade carton
Delivery Time :
5-8 work days
Hardness :
Shore D 75
Description

UV Moisture Dual Cure Adhesive

3290 UV Moisture Dual Cure Adhesive is specially formulated for chip fixing and electronic component reinforcement. It offers low odor, fluorescence detection for easy inspection, moisture curing in shadow areas, good toughness and excellent adhesion to a wide range of substrates. With a dielectric strength of 23 kV/mm, it provides reliable performance in precision electronic assembly.

Key Features

  • UV moisture dual-cure system: fast UV cure at 800 mJ/cm² plus moisture cure in shadow areas
  • Fluorescence detection for fast and easy adhesive inspection
  • Low odor formulation for a more operator-friendly working environment
  • Good toughness and excellent adhesion for reliable chip fixing and reinforcement
  • High dielectric strength of 23 kV/mm for insulation protection
  • Transparent blue appearance for easy visual identification

UV Moisture Dual Cure Adhesive Low Odor Fluorescence Detection Toughness Excellent Adhesion Chip Fixing

Applications

  • Chip fixing (die attach) in electronic assembly
  • Electronic component reinforcement and protection
  • Applications with shadow areas needing moisture cure
  • Bonding requiring fluorescence inspection
  • Precision bonding of electronic and structural parts

Technical Specifications

Color Transparent blue
Viscosity (25°C) 25000±10000 mPa.s
Curing Condition 800 mJ/cm² (UV + moisture)
Hardness Shore D 75
Dielectric Strength 23 kV/mm
Shelf Life 12 months (8-28°C)
Packaging 50g / 300g

FAQ

Q1: What is the 3290 adhesive mainly used for?
3290 is a UV moisture dual-cure adhesive designed for chip fixing (die attach) and electronic component reinforcement, providing reliable, durable bonding in precision assemblies.


Q2: How does the dual-cure system work?
It cures fast under UV light at 800 mJ/cm², and shadow areas not exposed to light cure gradually through moisture for complete curing.


Q3: How does fluorescence detection help?
The adhesive features fluorescence detection, making applied areas easy to inspect under UV light for accurate coverage and quality control.


Q4: How strong is the adhesion?
3290 provides excellent adhesion and good toughness, ensuring reliable chip fixing and component reinforcement performance.


Q5: Is the odor low during application?
Yes. 3290 features a low odor formulation, providing a more comfortable working environment for operators.


Q6: What are the storage conditions?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 50g and 300g packaging.

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UV Moisture Dual Cure Adhesive Low Odor Fluorescence Detection Toughness Excellent Adhesion Chip Fixing

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Viscosity (25°C) :
25000±10000 mPa.s
Model Number :
3290
Payment Terms :
T/T,L/C
Dielectric Strength :
23 kV/mm
Certification :
RoHS, REACH, ISO10993 certified
Price :
USD 3.99 / Piece/50g
Contact Supplier
video
UV Moisture Dual Cure Adhesive Low Odor Fluorescence Detection Toughness Excellent Adhesion Chip Fixing
UV Moisture Dual Cure Adhesive Low Odor Fluorescence Detection Toughness Excellent Adhesion Chip Fixing
UV Moisture Dual Cure Adhesive Low Odor Fluorescence Detection Toughness Excellent Adhesion Chip Fixing

Shenzhen Super- curing Opto-Electronic CO., Ltd

Verified Supplier
5 Years
shenzhen
Since 2012
Business Type :
Manufacturer
Total Annual :
1500000-2000000
Employee Number :
15~20
Certification Level :
Verified Supplier
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