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Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
Specifications
Brand Name :
UNICOMP
Model Number :
AX8300
Certification :
CE
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
Payment Terms :
T/T,L/C
Supply Ability :
30 sets per month
Delivery Time :
30 days
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Navigation And Positioning :
Quickly locate physical images
Door Open :
Hand-operated door
Detection Area :
129*129[mm]
Frame Rates :
Max30fps
Pixel Size :
84μm
Geometric Magnification :
48.8X (Under Specific Circumstances)
Description

Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance



The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection.

As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts.


System Summary Dimension 1215(W)∗1325(D)∗1700(H)mm
Machine Weight 1350kg
Power Supply 220V±10% 50Hz/60Hz 4A
Power Consumption 900W
X-Ray Tube Tube Type Sealed
Voltage 110kV
Max.Power 25W
Min.Resolution 5µm
Other Features X-Ray Safety <1µSv/h



Major applications:


PCBA BGA/IC LED Aliminum die casting Battery connector inspecting


1. Semiconductor package


2. Electronic connector module.


3. Original Package


4. Aerospace components


5. Medical appliances


6. Automation components



Application:


1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient

2. QFN:Bridging,Voids,Opens,Registration

3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others

4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID

5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias


Inspection Images

Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance


Application Fields

Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance

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Product Detail
Brand Name :
UNICOMP
Model Number :
AX8300
Certification :
CE
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
Contact Supplier
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
600~700
Certification Level :
Verified Supplier
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