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Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Specifications
Density :
2.9 g/cm³
Model Number :
TIF030-10
Keyword :
Thermal Conductive Gel
Payment Terms :
T/T
Materail :
Ceramic filled silicon material
Place of Origin :
China
Packaging Details :
30cc/PCS，50cc/pcs
Recommended Operating Temperature (℃) :
-40-200 ℃
MOQ :
1000tube
Delivery Time :
3-8 WORK DAYS
Thermal conductivity :
3.0W/m-K
Price :
0.1-100USD/KG
Color :
Gray
Certification :
UL
Application :
Telecom Industry
Supply Ability :
10000KG/MONTH
Products name :
Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Brand Name :
Ziitek
Description
TIF ®030-10 Soft Silicone Based Thermal Conductive Gel

TIF®030-10 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.

Key Features
  • High Thermal Conductivity (3.0 W/mK)
  • Soft with Very Low Compression
  • Low Thermal Impedance
  • Suitable for Automated Operation in Dispensing Systems
  • Proven Long-term Reliability
Applications
  • Heat-sink & Frame
  • LED Backlight Module, LED Lighting
  • High Speed Hardware Driver
  • Micro Heat Pipe Radiator
  • Vehicle Engine Controller
  • Communication Hardware
  • Semiconductor Automatic Laboratory Equipment
Typical Properties of TIF®030-10
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicon material -
Flow Rate (g/min)
(30cc syringe/2.5mm orifice/90 psi)		 12 Ziitek Test Method
Density (g/cm³) 2.9 ASTM D792
Thermal Conductivity (W/mK) 3.0 ASTM D5470
Thermal Impedance (℃-in²/W) @10psi 0.11 ASTM D5470
Thermal Impedance (℃-in²/W) @50psi 0.10 ASTM D5470
Recommended Operating Temperature -40~200℃ -
Breakdown Strength (V/mm) ≥4000 ASTM D149
Volume Resistivity (Ohm*cm) ＞1.0×10¹¹ ASTM D257
Bond Line Thickness (mm) 0.10 -
Flame Rating V-0 UL 94
Oil Separation (%) @150°C, 24 hrs ＜0.03 -
Volatility Loss (%) @150°C, 24 hrs ＜0.2 -
Packing Details

30 cc/pc, 50 cc/pc, 300 cc/pc

For more information about thermal conductive materials, please contact our company.

Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

  • Thermal gap pad
  • Thermal graphite sheet/film
  • Thermal double-sided tape
  • Thermal insulation pad
  • Thermal grease
  • Phase change material
  • Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: What are thermal pads used for?
A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.
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Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry

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Product Detail
Density :
2.9 g/cm³
Model Number :
TIF030-10
Keyword :
Thermal Conductive Gel
Payment Terms :
T/T
Materail :
Ceramic filled silicon material
Place of Origin :
China
Contact Supplier
Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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