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Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Specifications
Model Number :
TIF030AB-05R
Application :
Heat Dissipation In Electronics
Payment Terms :
T/T
Density :
3.1g/cm³
Place of Origin :
China
Cure @25℃ :
45 min
Packaging Details :
50cc/tube
MOQ :
1000tube
Delivery Time :
3-8 work days
Cure @70℃ :
10 min
Price :
0.1-100USD/tube
Thermal Conductivity :
3.0W/mK
Certification :
UL
Color :
Blue
Supply Ability :
100000tubes/MONTH
Keywords :
Thermally Conductive Gel
Brand Name :
Ziitek
Products name :
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Description
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Product Overview
TIF®050AB-11S is a two-component liquid gap filler material featuring high thermal conductivity, low thermal resistance, excellent electrical insulation, and high temperature aging resistance. After curing, its performance is equivalent to thermal conductive silicone rubber sheets, making it suitable for low stress and high compression modulus scenarios. The cured adhesive layer exhibits good pluggability, facilitating easy separation during RMA without damaging equipment.
Key Features
  • High thermal conductivity
  • Two-part formulation for easy storage
  • Excellent low and high temperature mechanical and chemical stability
  • Ultra-conforming low-stress interface application
  • Easy to remove for RMA rework, no substrate damage
Applications
  • Computer and peripherals
  • Telecommunications
  • Automotive electronics
  • Thermally conductive vibration dampening
  • Heat sink any heat generating semiconductor
Typical Properties - TIF®030AB-05R Series
Uncured Material Properties
Construction Ceramic filled silicon material -
Color/Part A White Visual
Color/Part B Blue Visual
Flow Rate (g/min) 25 Ziitek Test Method (50 cc syringe/1.5 mm orifice/90 psi)
Bond Line Thickness (mm) 0.15 -
Thermal Resistance (℃*in²/W) @10psi 0.09 ASTM D5470
Thermal Resistance (℃*in²/W) @50psi 0.08 ASTM D5470
Mix Ratio 1:1 -
Cure Schedule
Cure @25℃ 45 min Ziitek Test Method
Cure @70℃ 10 min Ziitek Test Method
Cure Material Properties
Color Blue Visual
Hardness (Shore 00) 50 ASTM D2240
Density (g/cm³) 3.1 ASTM D792
Thermal Conductivity (W/mK) 3.0 ASTM D5470
Breakdown Strength (V/mm) ≥5500 ASTM D149
Volume Resistivity (Ohm-cm) ＞1.0x10¹¹ ASTM D257
Recommended Operating Temperature (°C) -40~200℃ -
Flame Rating V-0 UL 94
Product Specifications
Available in 50 cc/pcs, 400 cc/pcs, or customized packaging for automation applications.
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Ziitek Company Culture
Quality: Do it right the first time, total quality control
Effectiveness: Work precisely and thoroughly for effectiveness
Service: Quick response, On time delivery and Excellent service
Team work: Complete teamwork across all departments to provide satisfying service for customers
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Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics

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Product Detail
Model Number :
TIF030AB-05R
Application :
Heat Dissipation In Electronics
Payment Terms :
T/T
Density :
3.1g/cm³
Place of Origin :
China
Cure @25℃ :
45 min
Contact Supplier
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics
Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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