Specifications
Hardness :
45 Shore 00
Construction & Composition :
Ceramic filled silicon material
Brand Name :
Ziitek
Model Number :
TIF050AB-11S
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
24*13*12cm cartons
Thermal Conductivity :
5.0W/mk
Density(g/cm³) :
3.2
Keyword :
Thermally Conductive Gel
Name :
Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components
Color A/B :
White / Gray
Application :
Electronics Components
Flame Rating :
UL 94V-0
Description

Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components

Ziitek TIF®050AB-11S is a high thermal conductivity_liquid gap-filling material adopting a two-component formulation, which can be tailored to differentiated curing requirements under varying temperatures.Specificallyengineered for low-stress assembly scenarios and high compressive modulus application requirements, this material forms intimate contact with mating surfaces during electronic product assembly, effectively reducing contact thermal resistance while delivering excellent electrical insulation performance.After curing, its performance is equivalent to that of thermal conductive silicone sheets, with outstanding high-temperature resistance and anti-aging stability.


Features


> Good thermal conductive: 5.0W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Applications

> Notebook
> Set top boxes
> Monitoring the Power Box
> Display card
> Mainboard/mother board
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components


Typical Properties of TIF®050AB-11S Series
Uncured Material Properties
Property Value Test Method
Construction & Composition Ceramic filled silicon material -
Color/Part A White Visual
Color/Part B Gray Visual
Component A Viscosity (mPa·s) 2,800,000 GB/T 10247
Component B Viscosity (mPa·s) 3,000,000 GB/T 10247
Flow Rate(g/min) 6 Ziitek Test Method
(50 cc syringei/1.5 mm orifice/90 psi)
Density(g/cm³) 3.2 ASTM D792
Bond Line Thickness (mm) 0.1 -
Thermal Resistance (℃·in²/W) @10psi 0.08 ASTM D5470
Thermal Resistance (℃·in²/W) @50psi 0.07 ASTM D5470
Mix Ratio 1:1 -
Shelf Life 12 months -
Cure Schedule
Pot Life @25℃ 30 min Ziitek Test Method
Cure @25℃ 60 min Ziitek Test Method
Cure @70℃ 30 min Ziitek Test Method
Cure Material Properties
Color Gray Visual
Hardness (Shore 00) 45 ASTM D2240
Recommended Operating Temperature (°C) -45~200℃ -
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Flame Rating V-0 UL 94
Thermal Conductivity(W/Mk) 5.0 ASTM D5470


Product Specification:


50 cc/pcs, 400 cc/pcs,or customized packaging for automation applications.
For information on products of different specifications, please contact our company.
If you want to learn more about our thermal conductivity products, please visit our oficial website.


Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components


Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract.


FAQ


Q: Are you trading company or manufacturer ?

A: We are manufacturer in China


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.


Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

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Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components

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Hardness :
45 Shore 00
Construction & Composition :
Ceramic filled silicon material
Brand Name :
Ziitek
Model Number :
TIF050AB-11S
Certification :
UL
Place of Origin :
China
Contact Supplier
video
Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components
Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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