Product Description: High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module The TIA®800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors...learn more
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
1000SQM/Day
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Dongguan Ziitek Electronical Material and Technology Co., Ltd

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11 Years
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