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High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
Specifications
Payment Terms :
T/T
Recommended Operating Temperature(℃) :
-40 ~ 125
Brand Name :
Ziitek
Model Number :
TIA800FG
Certification :
RoHs
Place of Origin :
China
MOQ :
10SQM
Supply Ability :
1000SQM/Day
Delivery Time :
3-7 Work days
Packaging Details :
10RL/bag
Color :
White
Thermal Conductivity :
0.8 W/mK
Application :
LED Module
Price :
Negotiation
Products name :
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
180° Peel Adhesion (gf/inch) Steel, Immediate :
≥ 1000
Adhesive Type :
Acrylic Adhesive
Backing Type :
Fiberglass
Description
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

The TIA®800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong adhesive strength and good thermal conductivity, aiming to replace traditional mechanical fixation and thermal conductive silicone grease, simplify assembly processes, improve product reliability, and are an ideal choice for solving the heat dissipation challenges of modern compact electronic devices.

Features
  • High bonding strength
  • Good thermal conductivity efficiency
  • Easy to apply and can be die-cut into custom sizes
  • Stable operation over a wide temperature range
Applications
  • Mount heat sink onto BGA graphic processor or drive processor
  • Mount heat spreader onto power converter PCB or onto motor control PCB
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat cure adhesive, screw mounting or clip mounting
Typical Properties of TIA®800FG Series
Product Name TIA®805FG TIA®806FG TIA®808FG TIA®810FG TIA®812FG TIA®815FG TIA®820FG Test Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Fiberglass ********
Recommended Operating Temperature(℃) -40 ~ 125 ********
Composite Thickness(inch/mm) 0.005/0.13 0.006/0.15 0.008/0.20 0.010/0.25 0.012/0.30 0.015/0.38 0.020/0.51 ASTM D374
Voltage Breakdown(V) ≥2500 ≥3000 ≥3500 ≥4000 ≥4200 ≥4500 ≥5000 ASTM D149
Thermal Conductivity(W/mK) 0.8 ASTM D5470
180° Peel Adhesion (gf/inch) Steel, Immediate ≥ 1000 ASTM D3330
180° Peel Adhesion (gf/inch) Steel, Steel 24 hrs ≥ 1200 ASTM D3330
Holding Power (H/inch) @25℃ ≥ 48 ASTM D3654
Holding Power (H/inch) @80℃ ≥ 48 ASTM D3654
Product Specifications

Standard Thickness: 0.005" (0.13 mm), 0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm), 0.015" (0.38 mm), 0.020" (0.51 mm)

Standard Size: 16" × 100" (406 mm × 30.48 m)

Reinforcing Carrier: TIA®800FG Series rolls can be reinforced with fiberglass.

The TIA® Series can be provided with die-cutting into various shapes. For different thicknesses or more information about thermally conductive materials, please contact our company.

High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
Company Profile

Dongguan Ziitek Electronic Material and Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Independent R&D team

Frequently Asked Questions
Q: How do I place an order?

A: 1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Product tags

heatsink thermal tape

,

heatsink adhesive tape

,

heat bond tape
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High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

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Product Detail
Payment Terms :
T/T
Recommended Operating Temperature(℃) :
-40 ~ 125
Brand Name :
Ziitek
Model Number :
TIA800FG
Certification :
RoHs
Place of Origin :
China
Contact Supplier
video
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module
High Bonding Strength 0.8 W/mK Thermal Conductive Double Side Tape For LED Module

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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