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Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB
Specifications
Brand Name :
ZIITEK
Model Number :
TIF500-20-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Payment Terms :
T/T
Product name :
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For Pcb
Keywords :
Thermal Gap Filler Pad
Thickness :
0.010"(0.25mm)~0.200"(5.00mm)
Hardness :
27Shore 00
Application :
LED PCB
Fire rating :
94-V0
Features :
Ultra soft and highly conformable
Thermal conductivity :
2.0W/m-K
Color :
Dark Gray
Description

Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

The TIF®500-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.


Features:

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance


Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF®500-20-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.5 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL94 (E331100)
Thermal conductivity 2.0 W/m-K ASTM D5470
2.0 W/m-K ISO22007

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

Packaging Details & Lead time

The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

Company profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

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Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF500-20-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB
Heat Transfer Thermal Interface Materials Thermal Conductive Silicone Thermal Gap Filler Pad For PCB

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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