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Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-30-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Payment Terms :
T/T
Products name :
Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Color :
Dark Gray
Thermal conductivity :
3.0W/m-K
Hardness :
27/65 Shore 00
Density :
3.0 g/cm³
Breakdown Voltage（V/mm)） :
≥5500
Flame rating :
94-V0
Keywords :
Silicone Thermal Conductive Pad
Application :
Motherboard Chip
Description

Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF®100-30-11U Series​ thermal pad is a very cost-effective general economic thermal gap filling gasket, soft with its own micro-stick, easy assembly. Under low compressing force to show good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction. Using heat sink or machine shell as a cooling device can effectively increase the cooling area to achieve a good cooling purposes.

Features

> Good thermal conductive

> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications

> Computer / communication equipment.
> Laptop / tablet / PC server.
> New energy power battery / vehicle equipment.
> Switching power supply / UPS.
> Video / security equipment.
> Any heating element and radiator.

Typical Properties of TIF®100-30-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIFseries is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ:

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Product tags

thermal conductive adhesive for led

,

acrylic led board

,

led acrylic board
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Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100-30-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
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Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip
Super Quality Self-Adhesive Surface 3.0W Dark Gray Silicone Thermal Conductive Pad For Motherboard Chip

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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