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Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Specifications
keywords :
Thermal Conductive Pad
Sample :
Free sample
Payment Terms :
T/T
Recommended Operating Temperature (℃) :
-40 to 200℃
Thermal conductivity :
2.0W/mK
Application :
For Enhanced Heat Dissipation In PCB CPU And LED Applications
Brand Name :
Ziitek
Model Number :
TIF100-20-16E
Certification :
RoHs UL
Place of Origin :
Dongguan
MOQ :
1000
Supply Ability :
10000PCS/days
Packaging Details :
1000pcs/Bag
Breakdown Voltage(V/mm) :
≥5500
Delivery Time :
3-7 work day
Products name :
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Price :
Negotiation
Density(g/cm³） :
2.7
Description

Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications


Company profile


Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.


Products description


The TIF®100-20-16E Series It is purple in color and is suitable for lamps and Cpus.Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features

>Good thermal conductive: 2.0 W/mK
>Soft and Compressible for low stress applications
>Available in varies thickness
>Soft and compressible for low stress applications
>Good thermal performance
>High tack surface reduces contact resistance
>RoHS compliant
>UL recognized

Applications


>CPU
>PCB/CPU/LED
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Routers

>Home appliance industry
>Power module
>Wearable device
>Solar photovoltaic panel
>LED lighting fixtures


Typical Properties of TIF®100-20-16E Series
Property Value Test method
Color Purple Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.7 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness (Shore 00) 65 35 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 5.0 ASTM D150
Volume Resistivity (Ohm-meter) ＞1.0X1012 ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 2.0W/m-K ASTM D5470
2.0W/m-K ISO22007


Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.



Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

Product tags

thermal conductive silicone pad

,

silicon free thermal gap pad

,

thermally conductive silicone adhesive
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Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

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Product Detail
keywords :
Thermal Conductive Pad
Sample :
Free sample
Payment Terms :
T/T
Recommended Operating Temperature (℃) :
-40 to 200℃
Thermal conductivity :
2.0W/mK
Application :
For Enhanced Heat Dissipation In PCB CPU And LED Applications
Contact Supplier
video
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications
Flexible Thermal Conductive Pad With High Stickiness Surface For Enhanced Heat Dissipation In PCB CPU And LED Applications

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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