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Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-30-25E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Payment Terms :
TT
Products name :
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft gap filler pad Hardness 35 Shore00
Thermal conductivity :
3.0W/m-K
Hardness :
35/65 Shore 00
Density(g/cm³） :
3.0
Dielectric Constant @1MHz :
7.0 MHz
Fire rating :
94-V0
Keywords :
thermal gap filler pad
Application :
AI Processors CPU Heatsink Colling
Description

Company pfofile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF®100-30-25E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features:

> Moldability for complex parts 3.0W/mK
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications:

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions

Typical Properties of TIF®100-30-25E Series
Property Value Test method
Color Pink Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

thermal conductive foam

,

thermally conductive elastomer

,

thermally conductive foam
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Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100-30-25E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00
Pink 3.0W/MK CPU Heatsink Colling Thermal Conductive Ultra Soft Gap Filler Pad Hardness 35 Shore00

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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