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Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Specifications
Specific Gravity :
2.0 g/cm³
Brand Name :
ZIITEK
Model Number :
TIF100-10-01U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Materails :
Ceramic filled silicone elastomer
Fire rating :
94-V0
Dielectric Constant :
4.5 MHz
Keywords :
Thermal Conductive Silicone Pad
Products name :
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation Silicone Pad For CPU
Payment Terms :
T/T
Thermal conductivity :
1.0W/m-K
Hardness :
27/65 Shore 00
Description
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Product Overview

The TIF®100-10-01U Series thermally conductive interface materials are applied to fill the air gaps between heating elements and heat dissipation fins or metal bases. Their flexibility and elasticity make them ideal for coating uneven surfaces. Heat can transmit to metal housing or dissipation plates from separate elements or entire PCBs, effectively enhancing the efficiency and lifespan of heat-generating electronic components.

Key Features
  • Good thermal conductivity: 1.5 W/mK
  • Naturally tacky - no additional adhesive coating required
  • Soft and compressible for low stress applications
  • Available in various thicknesses
  • Easy release construction
  • Electrically isolating
  • High durability
Applications
  • Cooling components to chassis or frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • CPU
  • Display card
  • Mainboard/motherboard
Technical Specifications
Property Value Test Method
Color Black Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0		 ASTM D374
Hardness (Shroe 00) 65 | 27 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MH 4.5 ASTM D150
Volume Resistivity ＞1.0*10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.0 W/m-K
1.0 W/m-K		 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"*16" (406 mm*406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Company Profile

Ziitek Electronic Material and Technology Ltd. is an R&D and production company with multiple production lines and processing technologies for thermal conductive materials. We own advanced production equipment and optimized processes, providing various thermal solutions for different applications.

Frequently Asked Questions
Q: Are you a trading company or manufacturer?
A: We are a manufacturer in China.
Q: How long is your delivery time?
A: Generally 3-7 work days if goods are in stock, or 7-10 work days if not in stock, depending on quantity.
Q: Do you provide samples? Is it free or extra cost?
A: Yes, we offer samples free of charge.
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Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

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Product Detail
Specific Gravity :
2.0 g/cm³
Brand Name :
ZIITEK
Model Number :
TIF100-10-01U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Contact Supplier
video
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU
Customized Various Thermal Conductive Silicone Pad Silicon Thermal Pad Heat Dissipation For CPU

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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