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Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100 2855-10
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Prodcuts name :
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Hardness :
55 Shore 00
Thermal conductivity :
2.8 W/m-K
Flame Rating :
UL 94 V-0
Continuos Use Temp :
-40 to 200℃
Keywords :
Thermal Pad
Specific Gravity :
3.0g/cc
Application :
AI Processors AI Servers
Description

Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers

The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate hardness. This balanced design provides good surface conformability and excellent ease of use, effectively delivering a thermal transfer path and basic physical protection for a wide range of electronic components.

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Features


> Good thermal conductive: 2.8W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance


Applications


> Cpu heat sinking
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

Typical Properties of The TIF®100 2855-10 Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 55 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.2 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 2.8 W/m-K ASTM D5470
2.8 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100 2855-10
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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