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Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-50-10E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Prodcuts name :
Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
Keywords :
Ultra Soft Thermal Pad
Flame Rating :
UL 94 V-0
Hardness :
35 Shore 00
Thermal conductivity :
5.0W/m-K
Continuos Use Temp :
-40 to 200℃
Specific Gravity :
3.4g/cc
Application :
Cloud Computing And Servers
Description

Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

TIF®100-50-10E Ultra Soft Thermal Pad

  • High thermal conductivity

  • Low thermal impedance

  • Good electrical insulation

This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.

Feature

Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, TIF®100-50-10E Ultra Soft Thermal Pad have outstanding thermal conductivity (5.0 W/m·K) and achieve an ultra-soft texture of Shore OO 35/65. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.

Application:


Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

Typical Properties of The TIF®100-50-10E Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

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Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100-50-10E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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