Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-12-66U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Payment Terms :
T/T
Products name :
High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules
Continuos Use Temp :
-40℃ to 200℃
Application :
Mainboard/Mother Boa/Memory Modules Cooling
Density :
2.0g/cm³
Hardness :
65/27 Shore 00
Color :
Green
Thermal conductivity& Compostion :
1.2W/m-K
Thickness :
0.010~0.20inch / 0.25~5.0mm
Construction :
Ceramic filled silicone elastomer
Keywords :
Thermal Conductive Silicone Pad
Description

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules

Product description

TIF®100-12-66U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines good thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit.

Features

> Excellent thermal conductivity: 1.2W/mK

> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

Typical Properties of TIF®100-12-66U Series
Property Value Test method
Color Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.2 W/m-K ASTM D5470
1.2 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules

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High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules

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Brand Name :
ZIITEK
Model Number :
TIF100-12-66U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules
High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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