Specifications
Brand Name :
ZIITEK
Model Number :
TIF500-75-11US
Certification :
UL
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Payment Terms :
T/T
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Products name :
7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors
Thickness :
0.50mm~5.0mm
Thermal conductivity :
7.5W/m-K
Color :
Dark Gray
Keywords :
Thermal Silicone Pads
Application :
AI Servers AI Processors
Density(g/cm³) :
3.45
Construction :
Ceramic filled silicone elastomer
Description

7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors

The TIF®500-75-11US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


> Good thermal conductive: 7.5W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

Typical Properties of TIF®500-75-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200

(1.00~5.00)

ASTM D374
Hardness 50 Shore 00 20 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 8.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal conductivity(w/m-K) 7.5 ASTM D5470
7.5 ISO 22007
Fire rating V-0 UL94 (E331100)
Standard Sheets Sizes:
Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

TheTIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors
Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

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7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors

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Brand Name :
ZIITEK
Model Number :
TIF500-75-11US
Certification :
UL
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
video
7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors
7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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