Specifications
Brand Name :
ZIITEK
Model Number :
TIF500-50-11E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Payment Terms :
T/T
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Product name :
High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling
Keywords :
Silicone Thermal Cooling Pad
Applicatioon :
Laptop AI Processors Cooling
Thermal conductivity :
5.0W/m-K
Hardness :
35 Shore 00
Thickness range :
0.25~5.0mm(0.010~0.20 inch)
Color :
Dark Gray
Construction & Compostion :
Ceramic filled silicone elastomer
Description

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Products description


TIF®500-50-11E Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability


Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

Typical Properties of TIF®500-50-11E Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 9.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Send your message to this supplier
Send Now

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

Ask Latest Price
Watch Video
Brand Name :
ZIITEK
Model Number :
TIF500-50-11E
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling
High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement