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5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling
5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling
5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling
5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling
Specifications
Brand Name :
ZIITEK
Model Number :
TIF500-50-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Payment Terms :
T/T
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Product name :
5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling
Construction & Compostion :
Ceramic filled silicone elastomer
Color :
Dark Gray
Thermal conductivity :
5.0W/m-K
Hardness :
27 Shore 00
Applicatioon :
Laptop AI Processors Cooling
Thickness range :
0.25~5.0mm(0.010~0.20 inch)
Keywords :
Heat Transfer Thermal Pad
Description

5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Products description


TIF®500-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance


Applications:

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIF®500-50-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

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5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF500-50-11U
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling
5.0 W/MK Heat Transfer Thermal Silicone Gel Pad High Performance Thermal Pad For AI Processors Cooling

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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