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High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
Specifications
MOQ :
1000pcs
Delivery Time :
3-5 days
Dielectric Constant @1MHz :
7.0
Payment Terms :
T/T
Keywords :
Thermal Pad
Model Number :
TIF800TS
Application :
GPU CPU Heatsink AI Servers Cooling Applications
Brand Name :
ZIITEK
Products name :
High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
Packaging Details :
1000pcs/bag
Price :
Negotiation
Fire rating :
94-V0
Supply Ability :
100000pcs/day
Thermal conductivity :
16.0 W/m-K
Certification :
UL and RoHs
Thickness :
0.75~5.0mm
Place of Origin :
China
Hardness :
45 Shore 00
Description

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications


Products description


The TIF®800TS Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes, while also possessing good mechanical _strength and compressibility, making it easy, to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.


Features:

> Excellent thermal conductivity: 16.0W/mK
> Good softness and filling properties
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance


Applications:


> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations


Typical Properties of TIF®800TS Series
Property Value Test method
Color Gray Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.030 0.040~0.200 ASTM D374
0.75 (1.00~5.00)
Hardness (Shore 00) 45 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 16.0W/m-K ISO22007


Products specification


Standard Thickness: 0.030" (0.75 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mm ×406 mm)


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

Company profile

Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ

Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.


Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

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High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

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Product Detail
MOQ :
1000pcs
Delivery Time :
3-5 days
Dielectric Constant @1MHz :
7.0
Payment Terms :
T/T
Keywords :
Thermal Pad
Model Number :
TIF800TS
Contact Supplier
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High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications
High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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