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Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Specifications
Fire rating :
94-V0
Keywords :
Thermal Gap Filler
Golor :
Gray
Thermal conductivity :
1.5W/m-K
Products name :
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Thickness :
2mmT
Brand Name :
ZIITEK
Model Number :
TIF180-02F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Hardness(Shore 00) :
65/60
Application :
Telecommunication Hardware &LED
Description
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials. Our extensive experience enables us to provide optimal assistance in thermal engineering, offering customized products, comprehensive product lines, and flexible production capabilities.
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Product Description
The TIF® 180-02F Series is a silicone-based, thermally conductive gap pad featuring an unreinforced construction for enhanced compliancy. This product offers low hardness, excellent conformability, and electrical isolation properties. The low modulus characteristics provide optimal thermal performance with easy handling, effectively transferring heat from electronic components to metal housings or dissipation plates, thereby improving efficiency and extending component lifespan.
Key Features
  • High tack surface reduces contact resistance
  • RoHS compliant 1.5 W/mK thermal conductivity
  • UL recognized certification
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Easy release construction
  • Electrically isolating properties
  • High durability performance
Applications
  • CPU thermal management
  • Display card cooling
  • Mainboard/motherboard applications
  • Notebook computers
  • Power supply units
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • Automotive electronics
Typical Properties - TIF® 100-02F Series
Property Value Test Method
Color Gray white Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.0 ASTM D150
Volume Resistivity (Ohm-meter) ＞1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470
ISO22007
Product Specifications

Product Thicknesses: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.010" (0.25mm)

Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or additional information, please contact us.
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Ziitek Corporate Culture
Quality
Do it right the first time, total quality control
Effectiveness
Work precisely and thoroughly for effectiveness
Service
Quick response, on-time delivery and excellent service
Team Work
Complete teamwork across all departments to support and service customer satisfaction
Product tags

100w led passive heatsink

,

led aluminum heatsink

,

epdm thermal conductivity
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Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware

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Product Detail
Fire rating :
94-V0
Keywords :
Thermal Gap Filler
Golor :
Gray
Thermal conductivity :
1.5W/m-K
Products name :
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Thickness :
2mmT
Contact Supplier
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Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating for LED and Telecommunication Hardware

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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