Specifications
Construction :
Ceramic filled silicone elastomer
Hardness :
60/65 shore 00
Brand Name :
ZIITEK
Model Number :
TIF180-02F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Application :
Laptop Graphics Card CPU GPU
Thermal condutivity :
1.5W/mK
Keywords :
Thermal Conductive Silicone Pad
Thickness :
2.0mmT
Density(g/cm³) :
2.3
Products name :
High Efficient 1.5W/mK Thermal Conductive Silicone Pad with 60/65 Shore 00 Hardness for Laptop Graphics Card CPU GPU
Description
High Efficient 1.5W/mK Thermal Conductive Silicone Pad with 60/65 Shore 00 Hardness for Laptop Graphics Card CPU GPU
Product Overview

The TIF® 180-02F Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively enhancing the efficiency and lifespan of heat-generating electronic components.

High Efficient 1.5W/mK Thermal Conductive Silicone Pad with 60/65 Shore 00 Hardness for Laptop Graphics Card CPU GPU
Key Features
  • Good thermal conductivity: 1.5 W/mK
  • Naturally tacky, requiring no additional adhesive coating
  • Soft and compressible for low stress applications
  • Available in various thicknesses
Applications
  • CPU
  • Display card/GPU
  • Mainboard/motherboard
  • Notebook/laptop
  • Power supply
  • Heat pipe thermal solutions
  • Memory modules
  • Mass storage devices
  • Automotive electronics
Technical Specifications
Property Value Test Method
Color Gray white Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.0 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.5 W/m-K ASTM D5470
ISO22007
Product Specifications

Product Thicknesses: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.010" (0.25mm)

Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

High Efficient 1.5W/mK Thermal Conductive Silicone Pad with 60/65 Shore 00 Hardness for Laptop Graphics Card CPU GPU
Certifications

ISO9001:2015

ISO14001:2004

IATF16949:2016

IECQ QC 080000:2017

UL Certified

Independent R&D Team

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High Efficient 1.5W/mK Thermal Conductive Silicone Pad with 60/65 Shore 00 Hardness for Laptop Graphics Card CPU GPU

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Construction :
Ceramic filled silicone elastomer
Hardness :
60/65 shore 00
Brand Name :
ZIITEK
Model Number :
TIF180-02F
Certification :
UL and RoHs
Place of Origin :
China
Contact Supplier
video
High Efficient 1.5W/mK Thermal Conductive Silicone Pad with 60/65 Shore 00 Hardness for Laptop Graphics Card CPU GPU
High Efficient 1.5W/mK Thermal Conductive Silicone Pad with 60/65 Shore 00 Hardness for Laptop Graphics Card CPU GPU

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
Contact Supplier
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