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Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Specifications
Thermal conductivity :
1.5W/m-K
Keywords :
Thermal Gap Pad
Products name :
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Construction :
Ceramic filled silicone elastomer
Specific gravity :
2.3g/cm³
Hardness :
65/60 shore 00
Brand Name :
ZIITEK
Model Number :
TIF120-02F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Payment Terms :
T/T
Supply Ability :
100000pcs/day
Delivery Time :
3-5 days
Packaging Details :
1000pcs/bag
Thickness :
0.5mmT
Flame rating :
94-V0
Description
Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Factory Profile
Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Product Description
The TIF ®120-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.
Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Features
  • Naturally tacky needing no further adhesive coating
  • Available in varies thicknesses
  • Broad range of hardnesses available
  • Moldability for complex parts
  • Outstanding thermal performance
  • High tack surface reduces contact resistance
  • RoHS compliant
Applications
  • CPU
  • Display card
  • Mainboard/mother board
  • Notebook
  • Power supply
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • Automotive electronics
Typical Properties of TIF ®100-02F Series
Property Value Test method
Color Gray white Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.0 ASTM D150
Volume Resistivity ＞1.0X10¹² Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K
1.5 W/m-K		 ASTM D5470
ISO22007
Product Specification
Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Ziitek Culture
Quality
Do it right the first time, total quality control
Effectiveness
Work precisely and thoroughly for effectiveness
Service
Quick response, On time delivery and Excellent service
Team work
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Product tags

thermally conductive foam pad

,

xps rigid foam insulation

,

thermal conductive silicone pad
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Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications

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Product Detail
Thermal conductivity :
1.5W/m-K
Keywords :
Thermal Gap Pad
Products name :
Ultra Soft Thermally Conductive Sheet Thermal Gap Pad Thermal Gap Filler For Low Stress Applications
Construction :
Ceramic filled silicone elastomer
Specific gravity :
2.3g/cm³
Hardness :
65/60 shore 00
Contact Supplier
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Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications
Ultra Soft 1.5W/m-K Thermal Gap Pad Ceramic Filled Silicone Elastomer for Low Stress Applications

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
12 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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