Ziitek is a high-tech enterprise dedicated to the research, development, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in this field, we provide the latest, most effective thermal management solutions. Our facility features advanced production equipment, comprehensive testing capabilities, and fully automatic coating production lines capable of manufacturing high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, and thermal grease. All products comply with UL94 V-0, SGS, and ROHS standards.

The TIF^®140-02F Series is an extremely soft gap filling material rated at a thermal conductivity of 1.5W/m-K. Specially formulated for high-performance applications requiring low assembly stress, this material offers exceptional thermal performance at low pressures due to its unique filler package and ultra-low modulus resin formulation. Ziitek TIF^®140-02F is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides for ease of use.

• Moldability for complex parts 1.5 W/mK
• Outstanding thermal performance
• High tack surface reduces contact resistance
• RoHS compliant
• UL recognized
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction

• CPU
• Display card
• Mainboard/mother board
• Notebook
• Power supply
• Heat pipe thermal solutions
• Memory Modules
• Mass storage devices
• Automotive electronics

Product Thicknesses: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.010" (0.25mm).

Product Sizes: 16" x 16" (406mm x 406mm)

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.