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3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
Specifications
Brand Name :
ZIITEK
Model Number :
TIF100-30-10F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5 work days
Packaging Details :
1000pcs/bag
Payment Terms :
T/T
Products name :
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
Construction & Compostion :
Ceramic filled silicone elastomer
Thermal conductivity :
3.0W/m-K
Hardness :
60 Shore 00
Density :
3.1g/cm³
Continuos Use Temp :
-40 to 200℃
Breakdown Voltage（V/mm） :
≥5500 VAC
Keywods :
Thermal Conductive Pad
Description

3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity for Computer CPU/GPU Cooling

Products description
The TIF®100-30-10F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Features

> Good thermal conductive 3.0 W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

> RoHS compliant
> UL recognized


Applications

> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
Typical Properties of TIF®100-30-10F Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.1 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 60 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.5 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ:

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Product tags

thermal conductive pads

,

thermal conductive silicone pad

,

thermal conductive pad 2mm
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3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF100-30-10F
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
negotiation
Contact Supplier
video
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity For Computer CPU/GPU Cooling

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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